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Influence of air abrasion and different dentin sealing techniques on microtensile bond strength to dentin

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°­µ¿È£ ( Kang Dong-Ho ) - ¿¬¼¼´ëÇб³ Ä¡°ú´ëÇÐ Ä¡°úº¸Ã¶Çб³½Ç
ÇÑÁ¾Çö ( Han Chong-Hyun ) - ¿¬¼¼´ëÇб³ Ä¡°ú´ëÇÐ Ä¡°úº¸Ã¶Çб³½Ç
±è¼±Àç ( Kim Sun-Jae ) - ¿¬¼¼´ëÇб³ Ä¡°ú´ëÇÐ Ä¡°úº¸Ã¶Çб³½Ç
¹ÚÁ¤¿ø ( Park Jeong-Won ) - ¿¬¼¼´ëÇб³ °­³²¼¼ºê¶õ½º Ä¡°úº´¿ø º¸Á¸°ú

Abstract

¿¬±¸¸ñÀû : º» ¿¬±¸¿¡¼­´Â ÀÚ°¡ºÎ½Ä Á¢ÂøÁ¦¸¦ ÀÌ¿ëÇÑ Áï½Ã »ó¾ÆÁú ºÀ¼â (immediate dentin sealing; IDS)¿Í Áö¿¬ »ó¾ÆÁú ºÀ¼â (delayed dentin sealing; DDS)¿¡¼­ »ó¾ÆÁú Á¢ÂøÁ¦ÀÇ °áÇÕ°­µµ¸¦ ºñ±³ÇÏ°í Áï½Ã »ó¾ÆÁú ºÀ¼â¿¡¼­ Á¢ÂøÁ¦ Ç¥¸éÀÇ ¿À¿°¹°À» Á¦°ÅÇϱâ À§ÇØ »ç¿ëµÇ´Â air abrasionÀÌ »ó¾ÆÁú¿¡ ´ëÇÑ ¹Ì¼¼ ÀÎÀå °áÇÕ°­µµ¿¡ ¾î¶°ÇÑ ¿µÇâÀ» ÁÖ´ÂÁö¿¡ ´ëÇØ Æò°¡ÇÏ¿´´Ù.

¿¬±¸ Àç·á ¹× ¹æ¹ý: 1°³¿ù À̳»¿¡ ¹ß°ÅµÈ »ç¶÷ÀÇ °ÇÀüÇÑ ´ë±¸Ä¡ 30°³¸¦ 6°³ÀÇ ±ºÀ¸·Î ºÐ¸®ÇÏ¿´°í »ó¾ÆÁú Á¢ÂøÁ¦·Î´Â ÀÚ°¡ºÎ½Ä Á¢ÂøÁ¦ Clearfil SE bond (Kuraray, Okayama, Japan)¸¦ »ç¿ëÇÏ¿´´Ù. ±ººÐ·ù´Â Ä¡°üºÎ¸¦ »èÁ¦ÇÏ¿© »ó¾ÆÁúÀ» ³ëÃâ½ÃŲ ÈÄ Áï½Ã Á¢ÂøÁ¦¸¦ µµÆ÷ÇÏ°í º¹ÇÕ·¹Áø Filtek Z250 (3M ESPE, St Paul, MN, USA)À» ÃæÀüÇÑ ±ºÀ» ´ëÁ¶±º (Control), ³ëÃâµÈ »ó¾ÆÁú¿¡ Áï½Ã »ó¾ÆÁú Á¢ÂøÁ¦¸¦ µµÆ÷ÇÏ°í 2ÁÖ ÈÄ ÀçÂ÷ Á¢ÂøÁ¦¸¦ µµÆ÷ÇØ º¹ÇÕ·¹Áø°ú °°ÀÌ ±¤ÁßÇÕÇÏ´Â Áï½Ã »ó¾ÆÁú ºÀ¼â±º (IDS), »ó¾ÆÁú ³ëÃâ ÈÄ »ó¾ÆÁú Á¢ÂøÀ» Áï½Ã ½ÃÇàÇÏÁö ¾Ê°í 2ÁÖ ÈÄ »ó¾ÆÁú Á¢Âø°ú º¹ÇÕ·¹ÁøÀÇ ÃæÀüÀ» ½ÃÇàÇÏ´Â Áö¿¬ »ó¾ÆÁú ºÀ¼â±º (DDS)À¸·Î ºÐ·ùÇÏ¿´´Ù. ±×ÈÄControl±º¿¡ air abrasionÀ» ½ÃÇàÇÑ ±ºÀ» C-A, IDS±º¿¡ air abrasionÀ» ½ÃÇàÇÑ ±ºÀ» IDS-A±º, DDS±º¿¡ air abrasionÀ» ½ÃÇàÇÑ ±ºÀ»DDS-A±ºÀ¸·Î ¼¼ºÐÈ­ÇÏ¿´´Ù. Control±º°ú C-AÀ» Á¦¿ÜÇÑ ¸ðµç ±ºÀº 2ÁÖ°£ FermitÀ» ÀÌ¿ëÇÑ Àӽüöº¹±â°£À» µÎ¾úÀ¸¸ç ´ëÁ¶±º°ú ½ÇÇ豺 ¸ðµÎ ¹Ì¼¼ÀÎÀå °áÇÕ°­µµ ½ÇÇè Àü 24½Ã°£µ¿¾È Áõ·ù¼ö¿¡ º¸°ü ÈÄ ¹Ì¼¼ÀÎÀå °áÇÕ°­µµ¸¦ ÃøÁ¤ÇÏ¿´´Ù. ÃøÁ¤µÈ ¹Ì¼¼ÀÎÀå °áÇÕ°­µµ´Â one-way ANOVA¸¦ ÀÌ¿ëÇÏ¿© ºñ±³ ºÐ¼®ÇÏ¿´À¸¸ç À¯ÀÇÂ÷°¡ ÀÖ´Â °æ¿ì Scheffe test¸¦ ÀÌ¿ëÇÑ »çÈÄ°ËÁõÀ» ½ÃÇàÇÏ¿´´Ù.

°á°ú : 1. ÀÚ°¡ºÎ½Ä »ó¾ÆÁú Á¢ÂøÁ¦ÀÎ Clearfil SE bond¸¦ Ä¡¾Æ »èÁ¦ Á÷ÈÄ »ó¾ÆÁú Á¢ÂøÀ» ½ÃÇàÇÏ°í 2ÁÖ°£ Àӽüöº¹ ±â°£À» °ÅÄ£ ÈÄ Á¢ÂøÁ¦¸¦ ÀçµµÆ÷ÇÏ°í º¹ÇÕ·¹ÁøÀ» ¼öº¹ÇÑ ±º°ú Ä¡¾Æ»èÁ¦ ÈÄ 2ÁÖ°£ÀÇ Àӽüöº¹±â°£À» °ÅÄ£ ÈÄ »ó¾ÆÁú Á¢ÂøÀ» ½ÃÇàÇÏ°í º¹ÇÕ·¹ÁøÀ» ¼öº¹ÇÑ ±º »çÀÌ¿¡ »ó¾ÆÁú-·¹Áø °£ ¹Ì¼¼ÀÎÀå °áÇÕ°­µµ´Â À¯ÀÇÇÑ Â÷ÀÌ°¡ ¾ø¾ú´Ù (P> .05).
2. ÀÚ°¡ºÎ½Ä »ó¾ÆÁú Á¢ÂøÁ¦ÀÎ Clearfil SE bond¸¦ »ó¾ÆÁú Á¢Âø ½ÃÇà Àü 50 ¥ìm Å©±âÀÇ aluminum oxide particle·Î air abrasion ó¸®ÇÏ´Â °ÍÀº »ó¾ÆÁú-·¹Áø °£ ¹Ì¼¼ÀÎÀå °áÇÕ°­µµ¿¡ À¯
ÀÇÇÑ ¿µÇâÀ» ÁÖÁö ¾Ê¾Ò´Ù (P> .05).

Purpose: The purpose of this study was to evaluate the effect of various methods of dentin bonding agent application and air abrasion pretreatment on microtensile bond strength between dentin and resin, using a self-etching adhesive system.

Materials and Methods : Thirty freshly extracted human molars were obtained and divided into 6 groups of 5 teeth. A 2-step self etching adhesive system (Clearfil SE Bond) was used for all groups. The control specimens were prepared using a direct immediate bonding technique. The delayed dentin sealing specimens were prepared using an indirect approach without dentin prebonding. The immediate dentin sealing specimens were prepared using dentin prebonding immediately following preparation. Immediate dentin sealing teeth and delayed dentin sealing teeth had provisional restorations using Fermit for two weeks. Then all specimens of each group were divided into two groups of three, depending on air abrasion pretreatment. Composite "crowns" were incrementally built on and specimens were stored in water for 24 hours. All teeth were prepared for a microtensile bond strength test. Bond strength data were analyzed with a one-way ANOVA test, and post hoc comparison was done using the Scheffe¡¯s test.

Results: The mean microtensile bond strengths of all groups were not statistically different from each other.

Conclusion: When preparing teeth for indirect restorations, IDS and DDS with Clearfil SE bond, have no difference on the microtensile bond strength between dentin and resin. Air abrasion pretreatment did not affect the microtensile bond strength when using IDS and DDS with Clearfil SE bond.

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Áï½Ã »ó¾ÆÁú ºÀ¼â;Áö¿¬ »ó¾ÆÁú ºÀ¼â;ÀÚ°¡ºÎ½Ä Á¢ÂøÁ¦;air abrasion;¹Ì¼¼ÀÎÀå °áÇÕ°­µµ
Immediate dentin sealing;Delayed dentin sealing;Clearfil SE bond;Microtensile bond strength

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